Display device having a plurality of pad terminals

ABSTRACT

A display device includes a substrate including a display area to display an image and a pad area positioned around the display area; a first pad unit disposed on the pad area, and including a first terminal region having a plurality of first pad terminals arranged in a first direction; and a printed circuit board including a base film and a second pad unit positioned at one side of the base film, the second pad unit being coupled with the first pad unit by electrically connecting with the plurality of first pad terminals. Each of the plurality of first pad terminals includes: at least three first connection pad terminals arranged in a first row disposed at a first angle larger than 0° and smaller than 90° relative to the first direction, the plurality of first connection pad terminals being in electrically connecting with the second pad unit of the printed circuit board through a plurality of conductive balls; a plurality of second connection pad terminals spaced apart from the plurality of first connection pad terminals, and arranged in a second row disposed at a second angle larger than 0° and smaller than 90° relative to the first direction, the plurality of second connection pad terminals being in electrically connecting with the second pad unit of the printed circuit board through another plurality of conductive balls; and a plurality of first dummy pad terminals disposed between pairs of adjacent first connection pad terminals of the first connection pad terminals.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.15/688,096, filed Aug. 28, 2017, which claims priority from and thebenefit of Korean Patent Application No. 10-2016-0116733, filed on Sep.9, 2016, which is hereby incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND Field

The invention relates generally to a display device, and moreparticularly, to a display device in which a large number of padterminals are accommodated in a non display area of the device.

DISCUSSION OF THE BACKGROUND

Currently known display devices include a liquid crystal display (LCD),a plasma display panel (PDP), an organic light emitting diode (OLED)display, a field emission display (FED), and an electrophoretic displaydevice.

Particularly, an OLED device includes two electrodes and an organicemission layer interposed therebetween. Electrons injected from oneelectrode and holes injected from the other electrode are bonded to oneanother in the organic emission layer to form excitons, and light isemitted while the excitons discharge energy.

The OLED device has self-luminance characteristics and does not requirea separate light source, unlike an LCD, and thus can have decreasedthickness and weight. Further, the OLED device exhibits high qualitycharacteristics, such as low power consumption, high luminance, and ahigh response rate, thereby attracting attentions as a next generationdisplay device.

In order to drive an organic light emitting diode of the OLED device, aprinted circuit board is coupled to a peripheral area of the substrate,and a signal required for driving the organic light emitting diode isreceived through the printed circuit board.

However, following the development of display devices with highresolution, the number of pad terminals coupled with the printed circuitboard and their associated connection lines have been increased. Whenthe number of lines connected to the pad terminals increase, the spacingbetween the lines decrease and density of the lines per unit areaincreases.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventiveconcepts, and, therefore, it may contain information that does not formprior art.

SUMMARY

Applicants have discovered that as the density of the pad terminals andtheir connecting lines increase, interference between the lines, suchthe resistance of some of the lines, increases, which may result inshort circuits and a decrease in the performance of the display device,e.g., a decrease in luminance.

Display devices constructed according to the principles of the inventioncan accommodate a large number of pad terminals and associatedconnecting lines in a peripheral area of the display while minimizingthe likelihood of lines being short-circuited within a pad terminal andthe attendant decrease in performance characteristics, such asluminance.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

According to one aspect of the invention, a display device includes asubstrate including a display area to display an image and a pad areapositioned around the display area; and a first pad unit disposed on thepad area, and including a first terminal region having a plurality offirst pad terminals arranged in a first direction, in which each of theplurality of first pad terminals includes: a plurality of firstconnection pad terminals arranged in a first row disposed at a firstangle relative to the first direction; a plurality of second connectionpad terminals spaced apart from the plurality of first connection padterminals, and arranged in a second row disposed at a second anglerelative to the first direction; and a first terminal connection lineconfigured to connect one of the plurality of first connection padterminals and one of the plurality of second connection pad terminals,and having at least one bent shape. The first terminal connection lineis disposed in a different layer from that of the first connection padterminal and the second connection pad terminal.

A plurality of data lines and a plurality of gate lines intersecting theplurality of data lines may be disposed in the display area of thesubstrate.

At least one of the plurality of first connection pad terminals and theplurality of second connection pad terminals may be disposed in the samelayer as that of the plurality of data lines, and the plurality of firstterminal connection lines may be disposed in the same layer as that ofthe plurality of gate lines.

The plurality of gate lines may include a plurality of first gatemembers and a plurality of second gate members disposed on the pluralityof first gate members, and the plurality of first terminal connectionlines may be disposed in the same layer as that of any one of theplurality of first gate members and the plurality of second gatemembers.

The display device may further include a plurality of first connectionlines disposed in the pad region to connect the display area and theplurality of first connection pad terminals.

The plurality of first connection lines may be disposed in the samelayer as that of the plurality of data lines.

The plurality of first connection lines may be disposed in the samelayer as that of the plurality of gate lines.

The plurality of gate lines may include a plurality of first gatemembers and a plurality of second gate members disposed on the firstgate member, and the plurality of first connection lines may be disposedin the same layer as that of any one of the plurality of first gatemembers and the plurality of second gate members.

The display device may further include a plurality of first test linesconnected to the plurality of second connection pad terminals,respectively, and extending to an end portion of one side of thesubstrate.

The plurality of first test lines may be disposed in the same layer asthat of the plurality of data lines.

The plurality of first test lines may be disposed in the same layer asthat of the plurality of gate lines.

The plurality of gate line may include a plurality of first gate membersand a plurality of second gate members disposed on the first gatemember, and the plurality of first test lines may be disposed in thesame layer as that of any one of the plurality of first gate members andthe plurality of second gate members.

The first angle may be substantially the same as the second angle.

Each of the first angle and the second angle may be larger than 0° andsmaller than 90°.

The first pad unit may further include a second terminal region having aplurality of second pad terminals spaced apart from the first terminalregion.

Each of the plurality of second pad terminals may include: a pluralityof third connection pad terminals arranged in a third row disposed at athird angle relative to the first direction; and a plurality of fourthconnection pad terminals spaced apart from the plurality of thirdconnection pad terminals, and arranged in a fourth row disposed at afourth angle relative to the first direction.

The third angle may be substantially the same as the fourth angle.

Each of the third angle and the fourth angle may be larger than 0° andsmaller than 90°.

The third angle may be substantially the same as the first angle.

The display device may further include a plurality of second test linesconnected to the plurality of fourth connection pad terminals,respectively, and extending to an end portion of one side of thesubstrate.

Each of the plurality of first connection pad terminals and theplurality of second connection pad terminals may have a plate-like,quadrangular shape.

The quadrangular shape is defined at least in part by a first sideparallel to the first direction, and a second side adjacent to the firstside and parallel to a second direction intersecting the firstdirection, and the second side may be longer than the first side.

The display device may further include: a printed circuit boardincluding a base film and a second pad unit positioned at one side ofthe base film, the second pad unit having a shape substantiallycorresponding to that of the first pad unit and being coupled with thefirst pad unit, in which the second pad unit includes a plurality offirst contact terminals coupled with the plurality of first padterminals, and each of the plurality of first contact terminals mayinclude: a plurality of first contact pad terminals arranged in a fifthrow disposed at the first angle relative to the first direction; and aplurality of second contact pad terminals spaced apart from theplurality of first contact pad terminals, and arranged in a sixth rowdisposed at a second angle relative to the first direction.

The printed circuit board may further include a plurality of firstterminal lines disposed on the base film, and the plurality firstterminal lines may be electrically connected with the plurality of firstcontact pad terminals disposed under the base film by a plurality offirst contact holes passing through the base film.

The plurality of first contact holes may overlap the plurality of firstcontact pad terminals, respectively.

According to another aspect of the invention, a display device includes:a substrate including a display area to display an image and a pad areapositioned around the display area; a first pad unit disposed on the padarea, and including a first terminal region having a plurality of firstpad terminals arranged in a first direction; and a printed circuit boardincluding a base film and a second pad unit positioned at one side ofthe base film, the second pad unit being coupled with the first pad unitby electrically connecting with the plurality of first pad terminals.Each of the plurality of first pad terminals includes: at least threefirst connection pad terminals arranged in a first row disposed at afirst angle larger than 0° and smaller than 90° relative to the firstdirection, the plurality of first connection pad terminals being inelectrically connecting with the second pad unit of the printed circuitboard through a plurality of conductive balls; a plurality of secondconnection pad terminals spaced apart from the plurality of firstconnection pad terminals, and arranged in a second row disposed at asecond angle larger than 0° and smaller than 90° relative to the firstdirection, the plurality of second connection pad terminals being inelectrically connecting with the second pad unit of the printed circuitboard through another plurality of conductive balls; and a plurality offirst dummy pad terminals disposed between pairs of adjacent firstconnection pad terminals of the first connection pad terminals.

A first one of the first dummy pad terminals may be disposed between afirst one of the first connection pad terminals and a second one of thefirst connection pad terminals, and a second one of the first dummy padterminals may be disposed between the second one of the first connectionpad terminals and a third one of the first connection pad terminals.

The first connection pad terminals and the first dummy pad terminals maybe arranged to be parallel to one another, and the first connection padterminals and the first dummy pad terminals may be serially arrangedalong the first row.

The first dummy pad terminals may be floated without receiving a signal.

The display device may include: a plurality of second dummy padterminals disposed between pairs of adjacent second connection padterminals of the second connection pad terminals.

A first one of the second dummy pad terminals may be disposed between afirst one of the second connection pad terminals and a second one of thesecond connection pad terminals, and a second one of the second dummypad terminals may be disposed between the second one of the secondconnection pad terminals and a third one of the second connection padterminals.

The second connection pad terminals and the second dummy pad terminalsmay be arranged to be parallel to one another, and the second connectionpad terminals and the second dummy pad terminals may be seriallyarranged along the second row.

The second dummy pad terminals may be floated without receiving asignal.

The display device may further include: a plurality of first terminalconnection lines configured to connect one of the plurality of firstconnection pad terminals and one of the plurality of second connectionpad terminals, and having at least one bent shape. The first terminalconnection line may be disposed in a different layer from that of thefirst connection pad terminal and the second connection pad terminal.

A plurality of data lines and a plurality of gate lines crossing theplurality of data lines may be disposed in the display area of thesubstrate.

At least one of the plurality of first connection pad terminals and theplurality of second connection pad terminals may be disposed in a samelayer as that of the plurality of data lines, and the plurality of firstterminal connection lines may be disposed in a same layer as that of theplurality of gate lines.

The plurality of gate lines may include a plurality of first gatemembers and a plurality of second gate members disposed on the pluralityof first gate members, and the plurality of first terminal connectionlines may be disposed in a same layer as that of any one of theplurality of first gate members and the plurality of second gatemembers.

The display device may further include: a plurality of first connectionlines disposed in the pad area to connect the display area and theplurality of first connection pad terminals.

The plurality of first connection lines may be disposed in a same layeras that of the plurality of data lines.

The plurality of first connection lines may be disposed in a same layeras that of the plurality of gate lines.

The plurality of gate lines include a plurality of first gate membersand a plurality of second gate members disposed on the plurality offirst gate members, and the plurality of first connection lines may bedisposed in a same layer as that of any one of the plurality of firstgate members and the plurality of second gate members.

The display device may further include: a plurality of first test linesconnected to the plurality of second connection pad terminals,respectively, and extending to an end portion of one side of thesubstrate.

The plurality of first test lines may be disposed in a same layer asthat of the plurality of data lines.

The plurality of first test lines may be disposed in a same layer asthat of the plurality of gate lines.

The plurality of gate lines may include a plurality of first gatemembers and a plurality of second gate members disposed on the pluralityof first gate members, and the plurality of first test lines may bedisposed in a same layer as that of any one of the plurality of firstgate members and the plurality of second gate members.

The first angle may be substantially same as the second angle.

The first pad unit may further include a second terminal region having aplurality of second pad terminals spaced apart from the first terminalregion.

Each of the plurality of second pad terminals may include: a pluralityof third connection pad terminals arranged in a third row disposed at athird angle relative to the first direction; and a plurality of fourthconnection pad terminals spaced apart from the plurality of thirdconnection pad terminals, and arranged in a fourth row disposed at afourth angle relative to the first direction.

The third angle may be substantially same as the fourth angle.

Each of the third angle and the fourth angle may be larger than 0° andsmaller than 90°.

The third angle may be substantially same as the first angle.

The display device may further include: a plurality of second test linesconnected to the plurality of fourth connection pad terminals,respectively, and extending to an end portion of one side of thesubstrate.

Each of the plurality of first connection pad terminals and theplurality of second connection pad terminals may have a plate-like,quadrangular shape.

The quadrangular shape may be defined at least in part by a first sideparallel to the first direction, and a second side adjacent to the firstside and parallel to a second direction crossing the first direction,and the second side may be longer than the first side.

The second pad unit may have a shape substantially corresponding to thatof the first pad unit and, may include a plurality of first contactterminals coupled with the plurality of first pad terminals, and each ofthe plurality of first contact terminals may include: a plurality offirst contact pad terminals arranged in a fifth row disposed at thefirst angle relative to the first direction; and a plurality of secondcontact pad terminals spaced apart from the plurality of first contactpad terminals, and arranged in a sixth row disposed at the second anglerelative to the first direction.

The printed circuit board may further include a plurality of firstterminal lines disposed on the base film, and the plurality of firstterminal lines are electrically connected with the plurality of firstcontact pad terminals disposed under the base film by a plurality offirst contact holes passing through the base film.

The plurality of first contact holes may overlap the plurality of firstcontact pad terminals, respectively.

Accordingly, display devices constructed according to the principles ofthe invention may accommodate a large number of pad terminals in aperipheral area of the device.

Further, exemplary embodiments of the invention can prevent lines withinthe pad terminal from being short circuited.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concepts, and, together with thedescription, serve to explain principles of the inventive concepts.

FIG. 1 is a schematic, exploded perspective view of a display deviceconstructed according to the principles of the invention.

FIG. 2 is a schematic, partial side view of the display device of FIG. 1showing the overlap and connection of a substrate pad and PCB pad.

FIG. 3 is a diagram schematically illustrating a display area of thedevice shown in FIG. 1.

FIG. 4 is a cross-sectional view taken along line IV-IV′ of FIG. 3.

FIG. 5 is an enlarged, plan view of a first terminal region of FIG. 1.

FIG. 6 is a cross-sectional view taken along line VI-VI′ of FIG. 5.

FIG. 7 is a cross-sectional view of a comparative example, in whichfirst and second connection pad terminals and a first terminalconnection line are disposed on the same layer.

FIG. 8 is a cross-sectional view illustrating a first modified exampleof the first terminal connection line of FIG. 6.

FIG. 9 is a cross-sectional view illustrating a second modified exampleof the first terminal connection line of FIG. 6.

FIG. 10 is a cross-sectional view illustrating a third modified exampleof the first terminal connection line of FIG. 6.

FIG. 11 is a cross-sectional view taken along line XI-XI′ of FIG. 5.

FIG. 12 is a cross sectional view illustrating a first modified exampleof a first connection line of FIG. 11.

FIG. 13 is a cross sectional view illustrating a second modified exampleof the first connection line of FIG. 11.

FIG. 14 is a cross sectional view illustrating a third modified exampleof the first connection line of FIG. 11.

FIG. 15 is an enlarged, plan view of a second terminal region of FIG. 1.

FIG. 16 is a cross-sectional view taken along line XVI-XVI′ of FIG. 15.

FIG. 17 is a cross-sectional view illustrating a first modified exampleof a second connection line of FIG. 16.

FIG. 18 is a cross-sectional view illustrating a second modified exampleof the second connection line of FIG. 16.

FIG. 19 is a diagram illustrating a modified example of first and secondterminal regions of FIG. 1.

FIG. 20 is a schematic top plan view of a printed circuit board coupledto the display device of FIG. 1.

FIG. 21 is an enlarged, plan view of a third terminal region of FIG. 20.

FIG. 22 is a cross-sectional view taken along line XXII-XXIII′ of FIG.21.

FIG. 23 is a diagram illustrating a modified example of a printedcircuit board of FIG. 21.

FIG. 24 is a diagram schematically illustrating a state where a firstterminal region formed in a substrate is coupled to a third terminalregion formed in the printed circuit board.

FIG. 25 is a cross-sectional view taken along line XXV-XXV′ of FIG. 24.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.FIG. 1 is a schematic, exploded perspective view of a display deviceconstructed according to the principles of the invention, and FIG. 2 isa schematic, partial side view of the display device of FIG. 1 showingthe overlap and connection of a substrate pad and PCB pad.

Referring to FIGS. 1 and 2, the exemplary display device may include asubstrate SUB, a first pad unit PAD_1, and a printed circuit board 300.

In one or more exemplary embodiments, the first pad unit PAD_1 coupledwith the printed circuit board 300 may include a first terminal regionTL_1, in which a plurality of first pad terminals PAD_TL_A (see FIG. 5)is disposed, and a second terminal region TL_2, in which a plurality ofsecond pad terminals PAD_TL_B (see FIG. 15) is disposed.

In this case, each of the first pad terminals PAD_TL_A (see FIG. 5)includes a plurality of first connection pad terminals ROW_PAD_A, aplurality of second connection pad terminals ROW_PAD_B, and firstterminal connection lines TL_CN_A. The first terminal connection linesTL_CN_A electrically connecting the first connection pad terminalsROW_PAD_A and the second connection pad terminals ROW_PAD_B may bedisposed on a different layer from that of the first connection padterminals ROW_PAD_A and the second connection pad terminals ROW_PAD_B.

The display device may include a display area DA and a pad area PNL_PAD.The display area DA and a pad area PNL_PAD represent an area positionedon the substrate SUB.

The display area DA is an area displaying an image, and a display panel100 (see FIG. 3) emitting light may be positioned in the display areaDA. The display panel 100 disposed in the display area DA will bedescribed below.

The pad area PNL_PAD is an area positioned in a peripheral area of thedisplay area DA, and the printed circuit board 300, which transmits asignal from the outside, may be coupled to the pad area PNL_PAD. Thefirst pad unit PAD_1 may be disposed in the pad area PNL_PAD and asecond pad unit PAD_2 may be disposed in the printed circuit board SUB,so that the first pad unit PAD_1 and the second pad unit PAD_2 may beelectrically coupled to each other.

In this case, the first pad unit PAD_1 may include a first terminalregion TL_1 and a second terminal region TL_2. The first terminal regionTL_1 and the second terminal region TL_2 represent areas positioned onthe substrate SUB.

AS described above, the plurality of first pad terminals PAD_TL_A (seeFIG. 5) may be disposed in the first terminal region TL_1 and theplurality of second pad terminals PAD_TL_B (see FIG. 15) may be disposedin the second terminal region TL_2. The plurality of first pad terminalsPAD_TL_A (see FIG. 5) and the plurality of second pad terminals PAD_TL_B(see FIG. 15) may have different shapes. A detailed description of thestructures of the first terminal region TL_1 and the second terminalregion TL_2 will be described below.

The first terminal region TL_1 and the second terminal region TL_2configuring the pad area PNL_PAD may be arranged in parallel in a firstdirection. In this case, the pad area PNL_PAD may be disposed whilebeing spaced apart from the display area DA in a second direction.Hereinafter, in the coordinates of the drawing, an X-axis represents thefirst direction, and the Y-axis represents the second direction.

In one or more exemplary embodiments, as illustrated in FIG. 1, thefirst terminal regions TL_1 may be disposed at both sides of the secondterminal region TL_2, respectively. However, the structural arrangementof the first terminal region TL_1 and the second terminal region TL_2 isnot limited thereto. For example, the first terminal region TL_1 may bepositioned between the pair of second terminal regions TL_2.

A connection line CL may be positioned between the display area DA andthe pad area PNL_PAD, and the display area DA and the pad area PNL_PADmay be connected through the connection line CL. The connection line CLmay be connected with a plurality of signal lines disposed in thedisplay area DA. Further, the connection line CL may be connected withthe plurality of first pad terminals PAD_TL_A (see FIG. 5) and theplurality of second pad terminals PAD_TL_B (see FIG. 15) of the pad areaPNL_PAD.

In this case, the connection line CL may include a first connection lineCL_A and a second connection line CL_B. The first connection line CL_Amay connect the display area DA and the first terminal region TL_1, andthe second connection line CL_B may connect the display area DA and thesecond terminal region TL_2. Particularly, the first connection lineCL_A may be connected with the plurality of first pad terminals PAD_TL_A(see FIG. 5) of the first terminal region TL_1, and the secondconnection line CL_B may be connected with the plurality of second padterminals PAD_TL_B (see FIG. 15) of the second terminal region TL_2.

The printed circuit board 300 may be coupled with the first pad unitPAD_1 of the pad area PNL_PAD of the substrate SUB to transmit a signalrequired for driving the display panel 100 to the display panel 100. Inthis case, a driving chip 350 may be mounted on a base film 310 of theprinted circuit board 300, and the driving chip 350 may be used fordriving the display panel 100.

In this case, the second pad unit PAD_2 may be formed at an end portionof one side of the base film 310 in the printed circuit board 300, andthe second pad unit PAD_2 may be coupled with the first pad unit PAD_1of the substrate SUB. The second pad unit PAD_2 may be disposed so as toface the first pad unit PAD_1.

The second pad unit PAD_2 may include a third terminal region TL_3 and afourth terminal region TL_4. The third terminal region TL_3 and thefourth terminal region TL_4 represent regions positioned in the basefilm 310.

A plurality of first contact terminals PAD_TL_C (see FIG. 21) may bedisposed in the third terminal region TL_3, and a plurality of secondcontact terminals (not illustrated) may be disposed in the fourthterminal region TL_4.

The plurality of first contact terminals PAD_TL_C (see FIG. 21) may havea shape corresponding to that of the plurality of first pad terminalsPAD_TL_A (see FIG. 5) so as to be in contact with the plurality of firstpad terminals PAD_TL_A (see FIG. 5). Further, the plurality of secondcontact terminals (not illustrated) may have a shape corresponding tothat of the plurality of second pad terminals PAD_TL_B (see FIG. 15) soas to be in contact with the plurality of second pad terminals PAD_TL_B(see FIG. 15).

That is, according to the one or more exemplary embodiments, the secondpad unit PAD_2 of the printed circuit board 300 may have a shapecorresponding to the first pad unit PAD_1 of the substrate SUB. Aplurality of pad terminals disposed in the second pad unit PAD_2 may bedisposed in a pattern, which is the same as or similar to that of theplurality of pad terminals of the first pad unit PAD_1. A detaileddescription of the structures of the third terminal region TL_3 and thefourth terminal region TL_4 will be described below.

Hereinafter, the display panel 100 formed in the display area DA will bedescribed in detail with reference to FIGS. 3 and 4.

FIG. 3 is a diagram schematically illustrating the display area of thedevice shown in FIG. 1, and FIG. 4 is a cross-sectional view taken alongline IV-IV′ of FIG. 3.

According to the one or more exemplary embodiments, the display panel100 includes first gate lines GW1, second gate lines GW2, data lines DW,a display unit 140, and pixels 150. In FIGS. 3 and 4, it is describedthat the gate lines include the first gate lines GW1 and the second gatelines GW2 positioned on different layers, but the gate lines are notlimited thereto, and may also be disposed on one layer.

A gate driver 210 sequentially supplies a scan signal to first scanlines SC2 to SC2 n or second scan lines SC1 to SC2 n−1 included in thefirst gate lines GW1 or the second gate lines GW2 in response to acontrol signal supplied from an external control circuit (notillustrated), for example, a timing controller. Here, n is an integerequal to or larger than 1, and the same is applied to the descriptionbelow.

Then, the pixel 150 is selected by the scan signal and sequentiallyreceives a data signal. Herein, the gate driver 210 illustrated in FIG.3 may be disposed within the driving chip 350 (see FIG. 1) on theprinted circuit board 300 (see FIG. 1), so that the gate driver 210illustrated in FIG. 3 is located in the display panel 100 forconvenience of the description.

The first gate lines GW1 are positioned on the substrate SUB with afirst insulating layer GI1 interposed therebetween, and are extended inthe first direction. The first gate lines GW1 include a second scan lineSC2 n−1 and an emission control line E1 to En.

The second scan line SC2 n−1 is connected to the gate driver 210, andreceives the scan signal from the gate driver 210. An emission controlline EN is connected with the emission control driver 220, and receivesan emission control signal from the emission control driver 220. Herein,the emission control driver 220 illustrated in FIG. 3 may be formedwithin the driving chip 350 (see FIG. 1) on the printed circuit board300 (see FIG. 1), similar to the gate driver 210, so that the emissioncontrol driver 220 illustrated in FIG. 3 is located in the display panel100 for convenience of the description.

The second gate lines GW2 are positioned on the first gate lines GW1with a second insulating layer GI2 interposed therebetween, and areextended in the first direction. The second gate lines GW2 include thefirst scan line SC2 n and an initialization power source line Vinit.

The first gate lines GW1 and the second gate lines GW2 do not overlapone another.

The first scan line SC2 n is connected to the gate driver 210, andreceives the scan signal from the gate driver 210. The initializationpower source line Vinit is connected to the gate driver 210, andreceives an initialization power source from the gate driver 210.

In the one or more exemplary embodiments, the initialization powersource line Vinit receives the initialization power source from the gatedriver 210, but the initialization power source line Vinit may beconnected with another additional configuration and receive theinitialization power source from the additional configuration.

The emission control driver 220 sequentially supplies the emissioncontrol signal to the emission control line EN in response to a controlsignal supplied from the outside, such as the timing controller. Then,the emission of the pixel 150 is controlled by the emission controlsignal.

That is, the emission control signal controls an emission time of thepixel 150. However, the emission control driver 220 may be omittedaccording to an internal structure of the pixel 150.

The data driver 230 supplies a data signal to the data line DAm of thedata lines DW in response to a control signal supplied from the outside,such as the timing controller. The data signal provided to the data lineDAm is provided to the pixel 150 selected by the scan signal wheneverthe scan signal is provided to the first scan lines SC2 n or the secondscan line SC2 n−1. Then, the pixel 150 charges a voltage correspondingto the data signal, and emits light with luminance corresponding to thecharge. Herein, the data driver 230 illustrated in FIG. 3 may be formedwithin the driving chip 350 (see FIG. 1) on the printed circuit board300 (see FIG. 1) to be described below, similar to the gate driver 210,so that the data driver 230 illustrated in FIG. 3 is located in thedisplay panel 100 for convenience of the description.

The data lines DW are positioned on the second gate lines GW2 with athird insulating layer ILD1 interposed therebetween, and are extended inthe second direction crossing the first direction. The data lines DWinclude data lines DA1 to DAm and a driving power source line ELVDDL.The data line DAm is connected to the data driver 230, and receives thedata signal from the data driver 230. The driving power source lineELVDDL is connected to an external first power source ELVDD which willbe described below, and receives a driving power source from the firstpower source ELVDD.

In this case, the driving power source line ELVDDL and the data line DAmmay be formed on the same layer on the third insulating layer ILD1.However, the inventive concepts are not limited thereto, and drivingpower source line ELVDDL and the data line DAm may be formed ondifferent layers.

For example, the driving power source line ELVDDL may be formed on thesame layer as that of the first gate lines GW1, and the data line DAmmay be formed on the same layer as that of the second gate lines GW2. Incontrast to this, the driving power source line ELVDDL may be formed onthe same layer as that of the second gate lines GW2, and the data lineDAm may be formed on the same layer as that of the first gate lines GW1.

The display unit 140 includes the plurality of pixels 150 positioned incrossing regions of the first gate lines GW1, the second gate lines GW2,and the data lines DW. Here, each pixel 150 includes an organic lightemitting diode, which emits light with luminance corresponding to adriving current corresponding to the data signal, and a pixel circuitfor controlling a driving current flowing in the organic light emittingdiode.

The pixel circuit is connected with each of the first gate lines GW1,the second gate lines GW2, and the data lines DW, and the organic lightemitting diode is connected with the pixel circuit. The pixel 150 isdescribed as the organic light emitting diode, but the pixel 150 of theexemplary display devices are not limited thereto, and may be take otherforms, such as a liquid crystal display device, an electrophoreticdisplay device, and the like.

The organic light emitting diode of the display unit 140 is connectedwith the external first power source ELVDD with the pixel circuitinterposed therebetween, and is connected with the second power sourceELVSS. Each of the first power source ELVDD and the second power sourceELVSS supplies a driving power source and a common power source to thepixel 150 of the display unit 140, respectively, and the pixel 150 emitslight with luminance corresponding to a driving current flowing from thefirst power source ELVDD to the organic light emitting diode in responseto a data signal according to the driving power source and the commonpower source supplied to the pixel 150.

As described above, in the exemplary display devices constructedaccording to the principles of the invention, each of the first gatelines GW1 and the second gate lines GW2, which are the gate linescrossing the pixel 150 in the first direction and not overlapping oneanother, is not positioned on the same layer, but each of the first gatelines GW1 and the second gate lines GW2 is positioned on differentlayers with the second insulating layer GI2 interposed therebetween, sothat it is possible to decrease a distance W between the gate lines,which are positioned in the different layers and adjacent to each other,thereby forming more pixels 150 in the same area. That is, it ispossible to form the display device having higher resolution.

Hereinafter, a structure of the first pad terminal PAD_TL_A disposed inthe first terminal region TL_1 will be described in detail withreference to FIGS. 5 to 14.

FIG. 5 is an enlarged, plan view of the first terminal region of FIG. 1,and FIG. 6 is a cross-sectional view taken along line VI-VI′ of FIG. 5.FIG. 8 is a cross-sectional view illustrating a first modified exampleof the first terminal connection line of FIG. 6, and FIG. 9 is across-sectional view illustrating a second modified example of the firstterminal connection line of FIG. 6. FIG. 11 is a view taken along lineXI-XI′ of FIG. 5, and FIG. 12 is a cross sectional view illustrating afirst modified example of the first connection line of FIG. 11. FIG. 13is a cross sectional view illustrating a second modified example of thefirst connection line of FIG. 11, and FIG. 14 is a cross sectional viewillustrating a third modified example of the first connection line ofFIG. 11.

Referring to FIGS. 5 and 6, the plurality of first pad terminalsPAD_TL_A may be disposed in the first terminal region TL_1 in the firstdirection. In this case, the first terminal region TL_1 may be connectedto the power source lines, for example, the driving power source lineELVDDL, the common power source line, the initialization power sourceline, and the scan line, of the display area DA (see FIG. 1) through thefirst connection line CL_A. The plurality of first pad terminalsPAD_TL_A may be disposed within the first terminal region TL_1 whilebeing spaced from one another with a predetermined interval in the firstdirection.

In one or more exemplary embodiments, each of the plurality of first padterminals PAD_TL_A may include a plurality of first connection padterminals ROW_PAD_A, a plurality of second connection pad terminalsROW_PAD_B, a plurality of first dummy pad terminals DM_TL_A, a pluralityof second dummy pad terminals DM_TL_B, and a plurality of first terminalconnection lines TL_CN_A.

The first connection pad terminals ROW_PAD_A may be disposed while beingspaced apart from one another in a predetermined direction. In thiscase, the first connection pad terminals ROW_PAD_A may be arranged in afirst row R1 which has a first inclination angle θ1 with the firstdirection. The first inclination angle θ1 may be larger than 0° andsmaller than 90°.

All of the first connection pad terminals ROW_PAD_A disposed in thefirst terminal region TL_1 may be disposed while being inclined in thesame direction. That is, the first connection pad terminals ROW_PAD_Amay be disposed while being inclined at the same angle based on thefirst direction within the first terminal region TL_1. For example, asillustrated in FIG. 5, the first connection pad terminals ROW_PAD_A maybe arranged while being inclined in a direction of approximately oneo'clock based on the second direction.

In one or more exemplary embodiments, the first terminal region TL_1 maybe disposed at each of a left side and a right side of the secondterminal region TL_2, and all of the first connection pad terminalsROW_PAD_A of the first terminal region TL_1 disposed at the left sideand the right side may be arranged while being inclined at the sameangle.

Intervals between the adjacent first connection pad terminals ROW_PAD_Amay be the same as one another. For example, an interval between a firstone of the first connection pad terminals ROW_PAD_A_1 and a second oneof the first connection pad terminals ROW_PAD_A_2, an interval betweenthe second one of the first connection pad terminals ROW_PAD_A_2 and athird one of the first connection pad terminals ROW_PAD_A_3, and aninterval between the third one of the first connection pad terminalsROW_PAD_A_3 and a fourth one of the first connection pad terminalsROW_PAD_A_4 may be the same. Herein, the interval between the firstconnection pad terminals ROW_PAD_A represents a spaced distance in thefirst row R1.

In this case, the first connection pad terminals ROW_PAD_A are regionselectrically contacting the first contact pad terminals ROW_PAD_E(referring to FIG. 21) of the printed circuit board 300, and mayapproximately have a quadrangular shape.

The second connection pad terminals ROW_PAD_B may be disposed whilebeing spaced apart from the first connection pad terminals ROW_PAD_A inthe second direction. Similar to the first connection pad terminalsROW_PAD_A, the second connection pad terminals ROW_PAD_B may be disposedwhile being spaced apart from one another in a predetermined direction.

In this case, the second connection pad terminals ROW_PAD_B may bearranged in a second row R2 which has a second inclination angle θ2 withthe first direction. The second inclination angle θ2 may be larger than0° and smaller than 90°.

All of the second connection pad terminals ROW_PAD_B disposed in thefirst terminal region TL_1 may be disposed while being inclined in thesame direction, similar to the first connection pad terminals ROW_PAD_A.That is, the second connection pad terminals ROW_PAD_B may be disposedwhile being inclined at the same angle based on the first directionwithin the first terminal region TL_1. For example, as illustrated inFIG. 5, the second connection pad terminals ROW_PAD_B may be arrangedwhile being inclined in the direction of approximately one o'clock basedon the second direction.

Similar to the first connection pad terminals ROW_PAD_A, all of thesecond connection pad terminals ROW_PAD_B of the first terminal regionTL_1 disposed at the left side and the right side of the second terminalregion TL2 may be disposed while being inclined at the same angle

In the illustrated exemplary embodiments, the first inclination angle θ1may be the same as the second inclination angle θ2. Accordingly, all ofthe first connection pad terminals ROW_PAD_A and the second connectionpad terminals ROW_PAD_B may be arranged while being inclined at the sameangle with respect to the first direction. However, the inventiveconcepts are not limited thereto, and the first inclination angle θ1 maybe different from the second inclination angle θ2. That is, the firstconnection pad terminals ROW_PAD_A and the second connection padterminals ROW_PAD_B may be arranged while being inclined at differentangles with respect to the first direction.

As illustrated in FIG. 19, the plurality of first pad terminals PAD_TL_Adisposed in both first terminal regions TL_1 may be disposed so as to besymmetric to one another based on the second terminal region TL_2. Forexample, the plurality of first pad terminals PAD_TL_A disposed in theleft first terminal region TL_1 based on the second terminal region TL_2may be disposed while being inclined in the direction of approximatelyone o'clock based on the second direction, and the plurality of firstpad terminals PAD_TL_A disposed in the right first terminal region TL_1based on the second terminal region TL_2 may be disposed while beinginclined in the direction of approximately eleven o'clock based on thesecond direction.

Intervals between the adjacent second connection pad terminals ROW_PAD_Bmay be the same as one another. For example, an interval between a firstone of the second connection pad terminals ROW_PAD_B_1 and a second oneof the second connection pad terminals ROW_PAD_B_2, an interval betweenthe second one of the second connection pad terminals ROW_PAD_B_2 and athird one of the second connection pad terminals ROW_PAD_B_3, and aninterval between the third one of the second connection pad terminalROW_PAD_B_3 and a fourth one of the second connection pad terminalsROW_PAD_B_4 may be the same. Herein, the interval between the secondconnection pad terminals ROW_PAD_B represents a spaced distance in thesecond row R2.

The second connection pad terminals ROW_PAD_B are regions electricallycontacting second contact pad terminals ROW_PAD_F of the printed circuitboard 300, and may approximately have a quadrangular shape.

In one or more exemplary embodiments, the quadrangular shape of each ofthe first connection pad terminals ROW_PAD_A and the second connectionpad terminals ROW_PAD_B may include a first side L1 parallel in thefirst direction and a second side L2 parallel in the second direction.Herein, the first side L1 and the second side L2 may be adjacent to eachother.

In this case, in the quadrangle, the second side L2 may be formed to belonger than the first side L1. (L1<L2). That is, the quadrangle may be arectangular shape elongated in the second direction.

When each of the first connection pad terminals ROW_PAD_A and the secondconnection pad terminals ROW_PAD_B is formed in a rectangular shapeelongated in the second direction, an interval between the firstconnection pad terminals ROW_PAD_A and the second connection padterminals ROW_PAD_B in the first direction may be decreased.

Accordingly, the number of first connection pad terminals ROW_PAD_Adisposed within the first terminal region TL_1 and the number of secondconnection pad terminals ROW_PAD_B disposed within the first terminalregion TL_1 may be increased.

The plurality of first connection pad terminals ROW_PAD_A and theplurality of second connection pad terminals ROW_PAD_B may be connectedby the first terminal connection lines TL_CN_A. More particularly, thefirst terminal connection line TL_CN_A may connect one of the firstconnection pad terminals ROW_PAD_A and one of second connection padterminals ROW_PAD_B to each other.

For example, the first one of the first connection pad terminalsROW_PAD_A_1 and the first one of the second connection pad terminalsROW_PAD_B_1 may be connected to each other by a first one of the firstterminal connection lines TL_CN_A_1, and the second one of the firstconnection pad terminals ROW_PAD_A_2 and the second one of the secondconnection pad terminals ROW_PAD_B_2 may be connected to each other by asecond one of the first terminal connection lines TL_CNA_2. Further, thethird one of the first connection pad terminals ROW_PAD_A_3 and thethird one of the second connection pad terminals ROW_PAD_B_3 may beconnected to each other by a third one of the first terminal connectionlines TL_CN_A_3, and the fourth one of the first connection padterminals ROW_PAD_A_4 and the fourth one of the second connection padterminals ROW_PAD_B_4 may be connected to each other by a fourth one ofthe first terminal connection lines TL_CN_A_4.

According to one or more exemplary embodiments, at least one firstterminal connection line TL_CN_A may have at least one bent portiondefining a bent shape. For example, as illustrated in FIG. 5, the firstone of the first terminal connection lines TL_CN_A_1 is extended fromthe first one of the second connection pad terminals ROW_PAD_B_1 to thefirst one of the first connection pad terminals ROW_PAD_A_1 in an updirection in the second direction. In this case, the first one of thefirst terminal connection lines TL_CN_A_1 may be disposed in a formwhich is bent in a right of the first direction, and then is bent in theup direction of the second direction again. That is, the first one ofthe first terminal connection lines TL_CN_A_1 may be disposed in a shapebent two times.

The first connection pad terminals ROW_PAD_A may be connected with thefirst connection lines CL_A. For example, the first one of the firstconnection pad terminals ROW_PAD_A_1 may be connected with the first oneof the first connection lines CL_A_1, and the second one of the firstconnection pad terminals ROW_PAD_A_2 may be connected with the secondone of the first connection lines CL_A_2. The third one of the firstconnection pad terminals ROW_PAD_A_3 may be connected with the third oneof the first connection lines CL_A_3, and the fourth one of the firstconnection pad terminals ROW_PAD_A_4 may be connected with the fourthone of the first connection lines CL_A_4.

In one or more exemplary embodiments, at least one first dummy padterminal DM_TL_A may be disposed between pairs of adjacent firstconnection pad terminals ROW_PAD_A of the first connection pad terminalsROW_PAD_A.

For example, a first one of the first dummy pad terminals DM_TL_A_1 maybe disposed between the first one of the first connection pad terminalsROW_PAD_A_1 and the second one of the first connection pad terminalsROW_PAD_A_2, and a second one of the first dummy pad terminals DM_TL_A_2may be disposed between the second one of the first connection padterminals ROW_PAD_A_2 and the third one of the first connection padterminals ROW_PAD_A_3. A third one of the first dummy pad terminalsDM_TL_A_3 may be disposed between the third one of the first connectionpad terminals ROW_PAD_A_3 and the fourth one of the first connection padterminals ROW_PAD_A_4, and a fourth one of the first dummy pad terminalsDM_TL_A_4 may be disposed while being adjacent to the fourth one of thefirst connection pad terminals ROW_PAD_A_4.

In FIG. 5, it is illustrated that one first dummy pad terminal DM_TL_Ais disposed between the pair of adjacent first connection pad terminalsROW_PAD_A. However, the inventive concepts are not limited thereto, andother configurations, such as two or more first dummy pad terminalsDM_TL_A may be provided.

In this case, the plurality of first connection pad terminals ROW_PAD_Aand the first dummy pad terminal DM_TL_A may be arranged to be parallelto each other. That is, the first connection pad terminals ROW_PAD_A andthe first dummy pad terminal DM_TL_A may be serially arranged along thefirst row R1, and may be disposed while being inclined in the firstinclination angle θ1 with respect to the first direction.

In one or more exemplary embodiments, the first dummy pad terminalsDM_TL_A are not electrically connected with the plurality of adjacentfirst connection pad terminals ROW_PAD_A or the plurality of firstterminal connection lines TN_CN_A_3.

At least one first dummy pad terminal DM_TL_A is disposed between thepair of adjacent first connection pad terminals ROW_PAD_A, so that aninterval between the adjacent first connection pad terminals ROW_PAD_Ais increased, thereby preventing capacitive coupling generated betweenthe first connection pad terminals ROW_PAD_A.

Further, at least one second dummy pad terminal DM_TL_B may be disposedbetween pairs of adjacent second connection pad terminals ROW_PAD_B ofthe second connection pad terminals ROW_PAD_B.

For example, a first one of the second dummy pad terminals DM_TL_B_1 maybe disposed between the first one of the second connection pad terminalsROW_PAD_B_1 and the second one of the second connection pad terminalsROW_PAD_B_2, and a second one of the second dummy pad terminalsDM_TL_B_2 may be disposed between the second one of the secondconnection pad terminals ROW_PAD_B_2 and the third one of the secondconnection pad terminals ROW_PAD_B_3. A third one of the second dummypad terminals DM_TL_B_3 may be disposed between the third one of thesecond connection pad terminals ROW_PAD_B_3 and the fourth one of thesecond connection pad terminals ROW_PAD_B_4, and a fourth one of thesecond dummy pad terminals DM_TL_B_4 may be disposed while beingadjacent to the fourth one of the second connection pad terminalsROW_PAD_B_4.

It is illustrated that one second dummy pad terminal DM_TL_B is disposedbetween the pair of adjacent second connection pad terminals ROW_PAD_B.However, the inventive concepts are not limited thereto, and two or moresecond dummy pad terminals DM_TL_B may be so disposed.

The second connection pad terminals ROW_PAD_B and the second dummy padterminals DM_TL_B may be arranged to be parallel to one another. Thatis, the second connection pad terminals ROW_PAD_B and the second dummypad terminal DM_TL_B may be serially arranged along the second row R2,and may be disposed while being inclined in the second inclination angleθ2 with respect to the first direction.

In one or more exemplary embodiments, the first terminal connection lineTL_CN_A may be disposed on a different layer from that of the firstconnection pad terminals ROW_PAD_A and the second connection padterminal ROW_PAD_B. The first terminal connection lines TL_CN_A areelectrically connected with the first connection pad terminals ROW_PAD_Aand the second connection pad terminals ROW_PAD_B, but the firstterminal connection lines TL_CN_A may be positioned on a different layerfrom that of the first connection pad terminals ROW_PAD_A and the secondconnection pad terminals ROW_PAD_B on the substrate SUB.

Hereinafter, a laminated structure of the first terminal connectionlines TL_CN_A and the first connection pad terminals ROW_PAD_A will bedescribed in detail with reference to FIG. 6. However, FIG. 6 does notillustrate a laminated structure of the first terminal connection linesTL_CN_A and the second connection pad terminals ROW_PAD_B, but thelaminated structure of the first terminal connection lines TL_CN_A andthe second connection pad terminals ROW_PAD_B may be the same as thelaminated structure of the first terminal connection lines TL_CN_A andthe first connection pad terminals ROW_PAD_A.

Referring to FIG. 6, for instance, the third one of the first connectionpad terminals ROW_PAD_A_3 and the adjacent fourth one of the firstconnection pad terminals ROW_PAD_A_4 may be disposed on the same layer.The fourth one of the first terminal connection lines TL_CN_A_4 may bedisposed on a different layer from that of the third one of the firstconnection pad terminals ROW_PAD_A_3 and the fourth one of the firstconnection pad terminals ROW_PAD_A_4.

Particularly, the first terminal connection line TL_CN_A may bepositioned in a lower portion of the third one of the first connectionpad terminals ROW_PAD_A_3 and the fourth one of the first connection padterminals ROW_PAD_A_4 in a cross-section, and the third insulating layerILD1 may be disposed between the fourth one of the first terminalconnection lines TL_CN_A_4 and the third one of the first connection padterminals ROW_PAD_A_3 and the fourth one of the first connection padterminals ROW_PAD_A_4. That is, based on the third insulating layerILD1, the fourth one of the first terminal connection lines TL_CN_A_4may be disposed under the third insulating layer ILD1, and the third oneof the first connection pad terminals ROW_PAD_A_3 and the fourth one ofthe first connection pad terminals ROW_PAD_A_4 may be disposed on across-section of the third insulating layer ILD1. A through-hole,through which a third one of the first lower pad lines SUB_PAD_A_3 and afourth one of the first lower pad lines SUB_PAD_A_4 positioned under thethird insulating layer ILD1 are partially exposed, may be formed in thethird insulating layer ILD1. Through the through hole, the third one ofthe first connection pad terminals ROW_PAD_A_3 may be in contact withthe third one of the first lower pad lines SUB_PAD_A_3 and the fourthone of the first connection pad terminals ROW_PAD_A_4 may be in contactwith fourth one of the first lower pad lines SUB_PAD_A_4. In this case,the third one of the first lower pad lines SUB_PAD_A_3 and the fourthone of the first lower pad lines SUB_PAD_A_4 may be positioned on thesame layer as that of the fourth one of the first terminal connectionlines TL_CN_A_4.

A fourth insulating layer ILD2, which covers the third one of the firstconnection pad terminals ROW_PAD_A_3 and the fourth one of the firstconnection pad terminals ROW_PAD_A_4, may be positioned on across-section of the third insulating layer ILD1. A through-hole,through which the third one of the first connection pad terminalsROW_PAD_A_3 and the fourth one of the first connection pad terminalsROW_PAD_A_4 are partially exposed, may be formed in the fourthinsulating layer ILD2. In this case, the exposed third one of the firstconnection pad terminals ROW_PAD_A_3 and fourth one of the firstconnection pad terminals ROW_PAD_A_4 may be electrically connected withthe first contact pad terminal ROW_PAD_E of the printed circuit board300 through a conductive ball CNB (see FIG. 24).

As described above, each of the third one of the first connection padterminals ROW_PAD_A_3 and the fourth one of the first connection padterminals ROW_PAD_A_4 may be electrically connected with the differentfirst contact pad terminals ROW_PAD_E of the printed circuit board 300.When the substrate SUB and the printed circuit board 300 are coupled toeach other, the third one of the first connection pad terminalsROW_PAD_A_3 and the fourth one of the first connection pad terminalsROW_PAD_A_4 may be electrically separated from each other. That is, thefourth one of the first terminal connection lines TL_CN_A_4 is disposedin the different layer from that of the third one of the firstconnection pad terminals ROW_PAD_A_3 and the fourth one of the firstconnection pad terminals ROW_PAD_A_4, so that it is possible to preventthe third one of the first connection pad terminals ROW_PAD_A_3 and thefourth one of the first connection pad terminals ROW_PAD_A_4 from beingshort-circuited from each other.

FIG. 7 is a cross-sectional view of a comparative example, in which thefirst and second connection pad terminals and the first terminalconnection line are disposed on the same layer, and when the fourth oneof the first terminal connection lines TL_CN_A_4 is disposed on the samelayer as that of the third one of the first connection pad terminalsROW_PAD_A_3 and the fourth one of the first connection pad terminalsROW_PAD_A_4, the third one of the first connection pad terminalsROW_PAD_A_3 and the fourth one of the first connection pad terminalsROW_PAD_A_4 may be short-circuited from each other.

Referring to FIG. 7, when the fourth one of the first terminalconnection lines TL_CN_A_4 is disposed on the same layer as that of thethird one of the first connection pad terminals ROW_PAD_A_3 and thefourth one of the first connection pad terminals ROW_PAD_A_4, the fourthinsulating layer ILD2 may be disposed on the fourth one of the firstterminal connection lines TL_CN_A_4. During a manufacturing process ofthe display device, a crack may be generated in the fourth insulatinglayer ILD2 covering the fourth one of the first terminal connectionlines TL_CN_A_4 and a part of the fourth insulating layer ILD2 may beseparated. In this case, a part of the fourth one of the first terminalconnection lines TL_CN_A_4 disposed under the fourth insulating layerILD2 may be exposed.

A part of the conductive ball CNB, which electrically connects the thirdone of the first connection pad terminals ROW_PAD_A_3 and the third oneof the first contact pad terminals ROW_PAD_E_3 may be in contact withthe fourth one of the exposed first terminal connection lines TL_CN_A_4.Accordingly, the fourth one of the first terminal connection linesTL_CN_A_4 is electrically connected to the third one of the firstconnection pad terminals ROW_PAD_A_3, and finally, the third one of thefirst connection pad terminals ROW_PAD_A_3 and the fourth one of thefirst connection pad terminals ROW_PAD_A_4 may be short-circuited fromeach other.

As described above, as illustrated in FIG. 7, when the fourth one of thefirst terminal connection lines TL_CN_A_4 is disposed on the same layeras that of the third one of the first connection pad terminalsROW_PAD_A_3 and the fourth one of the first connection pad terminalsROW_PAD_A_4, there is a concern that the third one of the firstconnection pad terminals ROW_PAD_A_3 and the fourth one of the firstconnection pad terminals ROW_PAD_A_4 may be short-circuited from eachother, but like the exemplary embodiment illustrated in FIG. 6, when thefourth one of the first terminal connection lines TL_CN_A_4 is disposedon the different layer from that of the third one of the firstconnection pad terminals ROW_PAD_A_3 and the fourth one of the firstconnection pad terminals ROW_PAD_A_4, it is possible to prevent thethird one of the first connection pad terminals ROW_PAD_A_3 and thefourth one of the first connection pad terminals ROW_PAD_A_4 from beingshort-circuited from each other. In the exemplary embodiments, the firstterminal connection line TL_CN_A may be disposed on the same layer asthat of the gate line disposed in the display area DA. For example, whenthe gate line of the display area DA is disposed in a single layer, thefirst terminal connection line TL_CN_A may be disposed on the same layeras that of the gate line of the single layer.

However, the inventive concepts are not limited thereto, and when thegate lines disposed in the display area DA are formed of the gate linesin dual layers, the first terminal connection lines TL_CN_A may bedisposed on the same layer as that of any one of the gate lines of thedual layers. For example, as illustrated in FIGS. 8 and 9, the fourthone of the first terminal connection lines TL_CN_A_4 may be disposed onthe same layer as that of any one of the first gate lines GW1 (see FIG.4) and the second gate lines GW2 (see FIG. 4).

Referring to FIG. 8, the fourth one of the first terminal connectionlines TL_CN_A_4 may be disposed on the same layer as that of the firstgate lines GW1 (see FIG. 4). Referring to FIG. 9, the first terminalconnection line TL_CN_A_4 may be disposed on the same layer as that ofthe second gate lines GW2 (see FIG. 4).

In contrast to this, the first connection pad terminals ROW_PAD_A may bedisposed on the same layer as that of the data line disposed in thedisplay area DA. For example, the first connection pad terminalROW_PAD_A_3 and the first connection pad terminal ROW_PAD_A_4 may bedisposed on the same layer as that of the data lines DW (see FIG. 4).

Referring to FIG. 10, the first terminal connection lines TL_CN_A andthe first connection pad terminals ROW_PAD_A may be formed of the datalines DW (see FIG. 4), but in this case, each of the first terminalconnection lines TL_CN_A and the first connection pad terminalsROW_PAD_A may be formed of the data lines DW disposed in the differentlayers. More particularly, FIG. 4 illustrates that the data lines DW aredisposed on the single layer, but the data lines DW may be disposed indual layers, which are disposed in different layers with the insulatinglayer interposed therebetween.

In this case, each of the first terminal connection lines TL_CN_A andthe first connection pad terminals ROW_PAD_A may be disposed on the samelayer as that of each of the data lines of the dual layers. For example,as illustrated in FIG. 10, the fourth one of the first connection padterminals ROW_PAD_A_4 adjacent to the third one of the first connectionpad terminals ROW_PAD_A_3 may be disposed on the same layer as that ofthe data lines positioned at an upper side among the data lines in thedual layers, and the fourth one of the first terminal connection linesTL_CN_A_4 may be disposed on the same layer as that of the data linespositioned at a lower side among the data lines in the dual layers. Thatis, the first terminal connection lines TL_CN_A and the first connectionpad terminals ROW_PAD_A are formed of the data lines DW (see FIG. 4),but the first terminal connection lines TL_CN_A and the first connectionpad terminals ROW_PAD_A may be disposed on different layers. However,the inventive concepts are not limited thereto, and the fourth one ofthe first terminal connection lines TL_CN_A_4 may be formed on the samelayer as that of any one of the gate lines of the dual layers.

In one or more exemplary embodiments, the first terminal connectionlines TL_CN_A are positioned on the different layers as that of thefirst connection pad terminals ROW_PAD_A, so that it is possible toprevent the first terminal connection lines TL_CN_A and the firstconnection pad terminals ROW_PAD_A from being short-circuited from eachother.

Accordingly, according to the exemplary embodiments, when the pluralityof first connection pad terminals ROW_PAD_A and the plurality of firstterminal connection lines TL_CN_A are disposed in the different layers,or the plurality of second connection pad terminals ROW_PAD_B and theplurality of first terminal connection lines TL_CN_A are disposed in thedifferent layers, it is possible to prevent the plurality of firstconnection pad terminals ROW_PAD_A and the first terminal connectionlines TL_CN_A, or the plurality of second connection pad terminalsROW_PAD_B and the first terminal connection lines TL_CN_A from beingshort-circuited from each other.

Referring to FIG. 5, first test lines TEST_LN_A may be connected to theplurality of second connection pad terminals ROW_PAD_B.

In this case, the first test line TEST_LN_A may be extended in a downdirection in the second direction. In the illustrated exemplaryembodiment, the first test lines TEST_LN_A may be extended up to an endportion of the substrate SUB.

Before the printed circuit board 300 is attached to the substrate SUB,first test pad terminals TEST_PAD_A may be positioned in end portions ofthe first test lines TEST_LN_A. That is, before the printed circuitboard 300 is coupled to the substrate SUB, the first test linesTEST_LN_A and the first test pad terminals TEST_PAD_A are positioned onthe substrate SUB. The first test pad terminals TEST_PAD_A may be usedfor examining the display panel before the printed circuit board 300 isattached to the substrate SUB. During a process of examining the displaypanel, a probe may be in contact with the first test pad terminalsTEST_PAD_A for the examination.

A first one of the first test pad terminals TEST_PAD_A_1 may beconnected to the first one of the first test lines TEST_LN_A_1, a secondone of the first test pad terminals TEST_PAD_A_2 may be connected to thesecond one of the first test lines TEST_LN_A_2, a third one of the firsttest pad terminals TEST_PAD_A_3 may be connected to the third one of thefirst test lines TEST_LN_A_3, and the fourth one of the first test padterminals TEST_PAD_A_4 may be connected to the fourth one of the firsttest lines TEST_LN_A_4.

However, when the printed circuit board 300 is attached to the substrateSUB, the first test pad terminals TEST_PAD_A are separated from thesubstrate SUB, so that some of the first test lines TEST_LN_A are lefton the substrate SUB coupled with the printed circuit board 300.

Referring to FIG. 11, the first one of the first connection padterminals ROW_PAD_A_1 may be disposed on the same layer as that of thefirst one of the first connection lines CL_A_1. That is, the first oneof the first connection pad terminals ROW_PAD_A_1 may be integrallyformed with the first one of the first connection lines CL_A_1. However,the inventive concepts are not limited thereto, and as illustrated inFIG. 12, the first one of the first connection pad terminals ROW_PAD_A_1may be disposed on different layer from that of the first one of thefirst connection lines CL_A_1. In this case, the first one of the firstconnection lines CL_A_1 may be positioned under the first one of thefirst connection pad terminals ROW_PAD_A_1, and the first one of thefirst connection lines CL_A_1 may be integrally formed with a first oneof the second lower pad lines SUB_PAD_B_1 positioned under the first oneof the first connection pad terminals ROW_PAD_A_1.

In addition, when the gate lines disposed in the display area DA areformed of the gate lines in dual layers, the first one of the firstconnection lines CL_A_1 may be disposed on the same layer as that of anyone of the gate lines of the dual layers.

For example, as illustrated in FIGS. 13 and 14, the first one of thefirst connection lines CL_A_1 may be disposed on the same layer as thatof any one of the first gate lines GW1 (see FIG. 4) and the second gatelines GW2 (see FIG. 4).

Particularly, referring to FIG. 13, the first one of the second lowerpad lines SUB_PAD_A2_1 and first one of the first lower pad linesSUB_PAD_A1_1 may be sequentially disposed under the first one of thefirst connection pad terminals ROW_PAD_A_1. In this case, the first oneof the second lower pad lines SUB_PAD_A2_1 and the first one of thefirst lower pad lines SUB_PAD_A1_1 may be disposed on the same layers asthose of the second gate lines GW2 (see FIG. 4) and the first gate linesGW1 (see FIG. 4), respectively. The first one of the first connectionlines CL_A_1 may be disposed on the same layer as that of the first oneof the second lower pad lines SUB_PAD_A2_1. That is, the first one ofthe first connection lines CL_A_1 may be integrally formed with thefirst one of the second lower pad lines SUB_PAD_A2_1.

Referring to FIG. 14, similar to FIG. 13, the first one of the secondlower pad lines SUB_PAD_A2_1 and the first one of the first lower padlines SUB_PAD_A1_1 may be sequentially disposed under the first one ofthe first connection pad terminals ROW_PAD_A_1. In this case, the firstone of the first connection lines CL_A_1 may be disposed on the samelayer as that of the first one of the first lower pad linesSUB_PAD_A1_1. That is, the first one of the first connection linesCL_A_1 may be integrally formed with the first one of the first lowerpad lines SUB_PAD_A1_1.

Hereinafter, a structure of the second pad terminal PAD_TL_B disposed inthe second terminal region TL_2 will be described in detail withreference to FIGS. 15 to 18.

FIG. 15 is an enlarged, plan view of a second terminal region of FIG. 1,and FIG. 16 is a cross-sectional view taken along line XVI-XVI′ of FIG.15. FIG. 17 is a cross sectional view illustrating a first modifiedexample of a second connection line of FIG. 16, and FIG. 18 is a crosssectional view illustrating a second modified example of the secondconnection line of FIG. 16.

Referring to FIGS. 15 and 16, the plurality of second pad terminalsPAD_TL_B may be disposed in the second terminal region TL_2. In thiscase, the second terminal region TL_2 may be connected with the datalines DW (see FIG. 3) disposed in the display area DA through the secondconnection lines CL_B. The plurality of second pad terminals PAD_TL_Bmay be disposed within the second terminal region TL_2 while beingspaced from one another with a predetermined interval in the firstdirection.

The plurality of second pad terminals PAD_TL_B may include a pluralityof third connection pad terminals ROW_PAD_C and a plurality of fourthconnection pad terminals ROW_PAD_D.

The third connection pad terminals ROW_PAD_C may be disposed while beingspaced apart from one another in a predetermined direction. In thiscase, the third connection pad terminals ROW_PAD_C may be arranged in athird row R3 which has a third inclination angle θ3 with the firstdirection. That is, the third connection pad terminals ROW_PAD_C may bearranged while being inclined at the third inclination angle θ3 withrespect to the first direction. The third inclination angle θ3 may belarger than 0° and smaller than 90°.

All of the third connection pad terminals ROW_PAD_C disposed in thesecond terminal region TL_2 may be disposed while being inclined in thesame direction. That is, the third connection pad terminals ROW_PAD_Cmay be disposed while being inclined at the same angle based on thefirst direction within the second terminal region TL_2. For example, asillustrated in FIG. 1, the third connection pad terminals ROW_PAD_C maybe arranged while being inclined in the direction of approximately oneo'clock based on the second direction.

However, the inventive concepts are not limited thereto, and asillustrated in FIG. 19, the plurality of third connection pad terminalsROW_PAD_C disposed in the second terminal region TL_2 may besymmetrically disposed based on a center of the second terminal regionTL_2. For example, the plurality of left third connection pad terminalsROW_PAD_C based on the center of the second terminal region TL_2 may bedisposed while being inclined in the direction of approximately oneo'clock based on the second direction, and the plurality of right thirdconnection pad terminals ROW_PAD_C based on the center of the secondterminal region TL_2 may be disposed while being inclined in thedirection of approximately eleven o'clock based on the second direction.

Intervals between the adjacent third connection pad terminals ROW_PAD_Cmay be the same as each other. For example, an interval between a firstone of the third connection pad terminals ROW_PAD_C_1 and a second oneof the third connection pad terminals ROW_PAD_C_2, an interval betweenthe second one of the third connection pad terminals ROW_PAD_C_2 and athird one of the third connection pad terminals ROW_PAD_C_3, and aninterval between the third one of the third connection pad terminalsROW_PAD_C_3 and a fourth one of the third connection pad terminalsROW_PAD_C_4 may be the same. Herein, the interval between the thirdconnection pad terminals ROW_PAD_C represents a spaced distance in thethird row R3.

The fourth connection pad terminals ROW_PAD_D may be disposed whilebeing spaced apart from the third connection pad terminals ROW_PAD_C inthe second direction. Similar to the third connection pad terminalsROW_PAD_C, the fourth connection pad terminals ROW_PAD_D may be disposedwhile being spaced apart from one another in a predetermined direction.

In this case, the fourth connection pad terminals ROW_PAD_D may bearranged in a fourth row R4 which has a fourth inclination angle θ4 withthe first direction. That is, the fourth connection pad terminalsROW_PAD_D may be arranged while being inclined at the fourth inclinationangle θ4 with respect to the first direction. The fourth inclinationangle θ4 may be larger than 0° and smaller than 90°.

All of the fourth connection pad terminals ROW_PAD_D disposed in thesecond terminal region TL_2 may be disposed while being inclined in thesame direction, similar to the third connection pad terminals ROW_PAD_C.That is, the fourth connection pad terminals ROW_PAD_D may be disposedwhile being inclined at the same angle based on the first directionwithin the second terminal region TL_2. For example, as illustrated inFIG. 1, the fourth connection pad terminals ROW_PAD_D may be arrangedwhile being inclined in the direction of approximately one o'clock basedon the second direction.

However, the inventive concepts are not limited thereto, and asillustrated in FIG. 19, the plurality of fourth connection pad terminalsROW_PAD_D disposed in the second terminal region TL_2 may besymmetrically disposed based on the center of the second terminal regionTL_2. For example, the plurality of left fourth connection pad terminalsROW_PAD_D based on the center of the second terminal region TL_2 may bedisposed while being inclined in the direction of approximately oneo'clock based on the second direction, and the plurality of right fourthconnection pad terminals ROW_PAD_D based on the center area of thesecond terminal region TL_2 may be disposed while being inclined in thedirection of approximately eleven o'clock based on the second direction.

In the exemplary embodiments, the third inclination angle θ3 may be thesame as the fourth inclination angle θ4. Accordingly, all of the thirdconnection pad terminals ROW_PAD_C and the fourth connection padterminals ROW_PAD_D may be arranged while being inclined at the sameangle with respect to the first direction. However, the inventiveconcepts are not limited thereto, and the third inclination angle θ3 maybe different from the fourth inclination angle θ4. That is, the thirdconnection pad terminals ROW_PAD_C and the fourth connection padterminals ROW_PAD_D may be arranged while being inclined at differentangles with respect to the first direction.

Intervals between the adjacent fourth connection pad terminals ROW_PAD_Dmay be the same as each other. For example, an interval between a firstone of the fourth connection pad terminals ROW_PAD_D_1 and a second oneof the fourth connection pad terminals ROW_PAD_D_2, an interval betweenthe second one of the fourth connection pad terminals ROW_PAD_D_2 and athird one of the fourth connection pad terminals ROW_PAD_D_3, and aninterval between the third one of the fourth connection pad terminalsROW_PAD_D_3 and a fourth one of the fourth connection pad terminalsROW_PAD_D_4 may be the same. Here, the interval between the fourthconnection pad terminals ROW_PAD_D represents a spaced distance in thefourth row R4.

In one or more exemplary embodiments, the second test lines TEST_LN_Bmay be connected to the plurality of fourth connection pad terminalsROW_PAD_D.

In this case, the second test line TEST_LN_B may be extended in a downdirection in the second direction. In the exemplary embodiment, similarto the first test lines TEST_LN_A, the second test lines TEST_LN_B maybe extended up to the end portion of the substrate SUB.

Before the printed circuit board 300 is attached to the substrate SUB,second test pad terminals TEST_PAD_B may be positioned in end portionsof the second test lines TEST_LN_B. That is, before the printed circuitboard 300 is coupled to the substrate SUB, the second test linesTEST_LN_B and the second test pad terminals TEST_PAD_B are positioned onthe substrate SUB.

A first one of the second test pad terminals TEST_PAD_B_1 may beconnected to a first one of the second test lines TEST_LN_B_1, a secondone of the second test pad terminals TEST_PAD_B_2 may be connected to asecond one of the second test lines TEST_LN_B_2, a third one of thesecond test pad terminals TEST_PAD_B_3 may be connected to a third oneof the second test lines TEST_LN_B_3, and a fourth one of the secondtest pad terminals TEST_PAD_B_4 may be connected to a fourth one of thesecond test lines TEST_LN_B_4.

However, similar to the first test pad terminals TEST_PAD_B, when theprinted circuit board 300 is attached to the substrate SUB, the secondtest pad terminals TEST_PAD_B are separated from the substrate SUB, sothat some of the second test lines TEST_LN_B are left on the substrateSUB coupled with the printed circuit board 300.

Each of the third connection pad terminal ROW_PAD_C and the fourthconnection pad terminal ROW_PAD_D of the second terminal region TL_2 maybe connected to the second connection line CL_B. Unlike the secondconnection pad terminal ROW_PAD_B of FIG. 5, the fourth connection padterminal ROW_PAD_D may be directly connected to the second connectionline CL_B.

For example, a first one of the third connection pad terminalsROW_PAD_C_1 may be connected with a first one of the second connectionlines CL_B_1, and a first one of the fourth connection pad terminalsROW_PAD_D_1 may be connected with a second one of the second connectionlines CL_B_2. A second one of the third connection pad terminalsROW_PAD_C_2 may be connected with a third one of the second connectionlines CL_B_3, and a second one the fourth connection pad terminalsROW_PAD_D_2 may be connected with a fourth one of the second connectionlines CL_B_4. A third one of the third connection pad terminalsROW_PAD_C_3 may be connected with a fifth one of the second connectionlines CL_B_5, and the third one of the fourth connection pad terminalsROW_PAD_D_3 may be connected with a sixth one of the second connectionlines CL_B_6. A fourth one of the third connection pad terminalsROW_PAD_C_4 may be connected with a seventh one of the second connectionlines CL_B_7, and a fourth one of the fourth connection pad terminalsROW_PAD_D_4 may be connected with a eighth one of the second connectionlines CL_B_8.

Referring to FIG. 16, all of the second connection lines CL_B may bedisposed on the same layer. For example, the adjacent first one of thesecond connection lines CL_B_1 and second one of the second connectionlines CL_B_2 may be disposed on the same layer.

Further, the third connection pad terminal ROW_PAD_C and the fourthconnection pad terminal ROW_PAD_D may also be disposed on the same layeras that of the plurality of second connection lines CL_B. For example,the first one of the third connection pad terminals ROW_PAD_C_1 and thefirst one of the fourth connection pad terminals ROW_PAD_D_1 may bedisposed on the same layer as that of the first one of the secondconnection lines CL_B_1 and the second one of the second connectionlines CL_B_2.

In one or more exemplary embodiments, the third connection pad terminalsROW_PAD_C, the fourth connection pad terminals ROW_PAD_D, and theplurality of second connection lines CL_B may be disposed on the samelayer as that of the data lines disposed in the display area DA.

However, an interlayer structure of the plurality of second connectionlines CL_B is not limited to the structure of FIG. 16, and the pluralityof second connection lines CL_B may be disposed on different layers.

The second test line TEST_LN_B may be disposed on the same layer as thatof the fourth connection pad terminals ROW_PAD_D. For instance, thefirst one of the second test lines TEST_LN_B_1 may be integrally formedwith the first one of the fourth connection pad terminals ROW_PAD_D_1.The first one of the second test lines TEST_LN_B_1 may be disposed onthe same layer as that of the data lines disposed in the display areaDA.

Referring to FIG. 17, pairs of adjacent connection lines CL_B of thesecond connection lines CL_B may be disposed on different layers. Forexample, the adjacent first one and third one of the second connectionlines CL_B_1 and CL_B_3 and second one and fourth one of the secondconnection lines CL_B_2 and CL_B_4 may be disposed on the differentlayers.

The first one and third one of the second connection lines CL_B_1 andCL_B_3 may be disposed on the same layer as that of the first one of thethird one connection pad terminal ROW_PAD_C_1 and the fourth connectionpad terminal ROW_PAD_D_1. On the other hand, the second one and thefourth one of the second connection lines CL_B_2 and CL_B_4 may bedisposed on the same layer as that of the first one of the lower padlines SUB_PAD_C_1 and the first one of the fourth lower pad linesSUB_PAD_D_1 positioned under the first one of the third connection padterminals ROW_PAD_C_1 and the first one of the fourth connection padterminals ROW_PAD_D_1. In this case, the first one of the third lowerpad lines SUB_PAD_C_1 and the first one of the fourth one lower padlines SUB_PAD_D_1 may be disposed on the same layer as that of the gatelines disposed in the display area DA. That is, the second one andfourth one of the second connection lines CL_B_2 and CL_B_4 may bedisposed on the same layer as that of the gate lines, and the first oneand third one of the second connection lines CL_B_1 and CL_B_3 may bedisposed on the same layer as that of the data lines.

The second test line TEST_LN_B may be disposed on the same layer as thatof the fourth lower pad line SUB_PAD_D. For instance, the first one ofthe second test lines TEST_LN_B_1 may be integrally formed with thefirst one of the fourth lower pad lines SUB_PAD_D_1. The first one ofthe second test lines TEST_LN_B_1 may be disposed on the same layer asthat of the gate lines disposed in the display area DA.

Pairs of adjacent second connection lines CL_B of the second connectionlines CL_B may be disposed on different layers, and further, each of thepair of adjacent second connection lines CL_B may be disposed on thesame layer as that of any one of the gate lines of the dual layers.

For example, as illustrated in FIG. 18, the first one to fourth one ofthe second connection lines CL_B_1 to CL_B_4 may be disposed on the samelayer as that of any one of the first gate lines GW1 (see FIG. 4) andthe second gate lines GW2 (see FIG. 4).

Particularly, referring to FIG. 18, the lower pad line SUB_PAD_C2_1 andthe lower pad line SUB_PAD_C1_1 may be sequentially disposed under thefirst one of the third connection pad terminals ROW_PAD_C_1. Further,the lower pad line SUB_PAD_D2_1 and the lower pad line SUB_PAD_D1_1 maybe sequentially disposed under the first one of the fourth connectionpad terminals ROW_PAD_D_1.

In this case, the lower pad line SUB_PAD_C2_1 and the lower pad lineSUB_PAD_D2_1 may be disposed on the same layer as that of the secondgate lines GW2 (see FIG. 4). The lower pad line SUB_PAD_C1_1 and thelower pad line SUB_PAD_D1_1 may be disposed on the same layer as that ofthe first gate lines GW1 (see FIG. 4).

The first one and the third one of the second connection lines CL_B_1and CL_B_3 may be disposed on the same layer as that of the lower padlines SUB_PAD_C1_1 and SUB_PAD_D1_1. The second one and fourth one ofthe second connection lines CL_B_2 and CL_B_4 may be disposed on thesame layer as that of the lower pad lines SUB_PAD_C2_1 and SUB_PAD_D2_1.

The first one of the second test lines TEST_LN_B_1 may be disposed onthe same layer as that of the first one of the lower pad linesSUB_PAD_D1_1. That is, the first one of the second test linesTEST_LN_B_1 may be integrally formed with the lower pad lineSUB_PAD_D1_1.

Hereinafter, the exemplary printed circuit board 300 coupled to thedisplay device will be described with reference to FIGS. 20 to 23.

FIG. 20 is a schematic top plan view of the printed circuit boardcoupled to the display device of FIG. 1, and FIG. 21 is an enlarged,plan view of the third terminal region of FIG. 20. FIG. 22 is across-sectional view taken along line XXII-XXII′ of FIG. 21, and FIG. 23is a diagram illustrating a modified example of the printed circuitboard of FIG. 21.

Referring to FIG. 20, the printed circuit board 300 may include the basefilm 310, the second pad unit PAD_2, and the driving chip 350.

The second pad unit PAD_2 may be disposed at an end portion at one sideof the flexible base film 310. According to the illustrated exemplaryembodiment, the second pad unit PAD_2 may be formed in a shapecorresponding to a shape of the first pad unit PAD_1 of the substrateSUB. The second pad unit PAD_2 of the printed circuit board 300 and thefirst pad unit PAD_1 of the substrate SUB are formed in correspondingshapes so that the first pad unit PAD_1 and the second pad unit PAD_2may be easily coupled to each other.

The second pad unit PAD_2 may include the third terminal region TL_3 andthe fourth terminal region TL_4. The third terminal region TL_3 and thefourth terminal region TL_4 represent regions positioned on the basefilm 310. The third terminal region TL_3 and the fourth terminal regionTL_4 may be arranged in parallel on the base film 310 in the firstdirection.

According to the illustrated exemplary embodiment, the third terminalregions TL_3 may be disposed at both sides of the fourth terminal regionTL_4, respectively. However, the inventive concepts are not limitedthereto, and the third terminal region TL_3 may be disposed between thepair of fourth terminal regions TL_4.

However, the arrangement of the third terminal regions TL_3 and thefourth terminal regions TL_4 is determined according to the arrangementof the first terminal regions TL_1 and the second terminal regions TL_2disposed on the substrate SUB. For example, when the second terminalregions TL_2 are disposed at both sides of the first terminal regionTL_1, respectively, the fourth terminal regions TL_4 may be disposed atboth sides of the third terminal region TL_3, respectively. When thesecond terminal region TL_2 is disposed between the pair of firstterminal regions TL_1, the fourth terminal region TL_4 may be disposedbetween the pair of third terminal regions TL_3.

Referring to FIGS. 21 and 22, the third terminal region TL_3 is a regioncorresponding to the first terminal region TL_1 of the substrate SUB,and the plurality of first contact terminals PAD_TL_C may be disposed onthe third terminal region TL_3.

The plurality of first contact terminals PAD_TL_C may be disposed in thesame pattern as that of the first pad terminals PAD_TL_A disposed in thefirst terminal region TL_1.

Each of the plurality of first contact terminals PAD_TL_C may includethe first contact pad terminal ROW_PAD_E and the second contact padterminal ROW_PAD_F.

In the illustrated exemplary embodiment, the first contact pad terminalsROW_PAD_E may be disposed while being spaced apart from one another in apredetermined direction. In this case, the first contact pad terminalsROW_PAD_E may be arranged while being inclined at the first inclinationangle θ1 with respect to the first direction. That is, the first contactpad terminals ROW_PAD_E may be arranged while being inclined at the sameangle as that of the first connection pad terminals ROW_PAD_A of thesubstrate SUB. The first inclination angle θ1 may be larger than 0° andsmaller than 90°.

Intervals between the adjacent first contact pad terminals ROW_PAD_E maybe the same as each other. For example, an interval between a first oneof the first contact pad terminals ROW_PAD_E_1 and a second one of thefirst contact pad terminals ROW_PAD_E_2, an interval between the secondone of the first contact pad terminals ROW_PAD_E_2 and a third one ofthe first contact pad terminals ROW_PAD_E_3, and an interval between thethird one of the first contact pad terminals ROW_PAD_E_3 and a fourthone of the first contact pad terminals ROW_PAD_E_4 may be the same. Inthis case, the adjacent first contact pad terminals ROW_PAD_E may bearranged with the same interval as that of the first connection padterminals ROW_PAD_A.

The first contact pad terminals ROW_PAD_E are regions electricallycontacting the first connection pad terminals ROW_PAD_A of the substrateSUB, and may approximately have a quadrangular shape.

The second contact pad terminals ROW_PAD_F may be disposed while beingspaced apart from the first contact pad terminals ROW_PAD_E_in thesecond direction. Similar to the first contact pad terminals ROW_PAD_E,the second contact pad terminals ROW_PAD_F may also be disposed whilebeing spaced apart from one another in a predetermined direction.

In this case, the second contact pad terminals ROW_PAD_F may have thesecond inclination angle θ2 with the first direction. That is, thesecond contact pad terminals ROW_PAD_F may be arranged while beinginclined at the second inclination angle θ2 with respect to the firstdirection. That is, the fourth connection pad terminals ROW_PAD_D may bearranged while being inclined at the same angle as that of the secondconnection pad terminals ROW_PAD_B of the substrate SUB. In this case,the second inclination angle θ2 may be larger than 0° and smaller than90°.

In the exemplary embodiments, similar to the first connection padterminal ROW_PAD_A and the second connection pad terminal ROW_PAD_B ofthe substrate SUB, the first inclination angle θ1 may be the same as thesecond inclination angle θ2. Accordingly, all of the first contact padterminals ROW_PAD_E and the second contact pad terminals ROW_PAD_F maybe arranged while being inclined at the same angle with respect to thefirst direction.

However, the inventive concepts are not limited thereto, and the firstinclination angle θ1 may be different from the second inclination angleθ2. Accordingly, all of the first contact pad terminals ROW_PAD_E andthe second contact pad terminals ROW_PAD_F may be inclined at differentangles with respect to the first direction.

Intervals between the adjacent second contact pad terminals ROW_PAD_Fmay be the same as each other. For example, an interval between a firstone of the second contact pad terminals ROW_PAD_F_1 and a second one ofthe second contact pad terminals ROW_PAD_F_2, an interval between thesecond one of the second contact pad terminals ROW_PAD_F_2 and a thirdone of the second contact pad terminals ROW_PAD_F_3, and an intervalbetween the third one of the second contact pad terminals ROW_PAD_F_3and a fourth one of the second contact pad terminals ROW_PAD_F_4 may bethe same.

The second contact pad terminals ROW_PAD_F are regions electricallycontacting the second connection pad terminals ROW_PAD_B of thesubstrate SUB, and may approximately have a quadrangular shape.

A first terminal line PL_A_1 and a second terminal line P_L_B_1 may bepositioned at both sides, that is, an upper side and a lower side, basedon the base film 310 on the printed circuit board SUB. The firstterminal line PL_A_1 may be positioned on the base film 310, and thesecond terminal line P_L_B_1 may be positioned under the base film 310.In this case, each of the first terminal line PL_A_1 and the secondterminal line P_L_B_1 may be electrically connected with the drivingchip 350.

A first passivation layer SR1 may be disposed on the first terminal lineP_L_A_1 and a second passivation layer SR2 may be disposed on the secondterminal line P_L_B_1. In this case, the first passivation layer SR1 andthe second passivation layer SR2 may be solder resists.

The first contact pad terminal ROW_PAD_E and the second contact padterminal ROW_PAD_F may be formed on the same layer as that of the secondterminal line P_L_B_1. For instance, a part of the second passivationlayer SR2 is removed and a part of the second terminal line PLB_1 isexposed, so that the first one of the first contact pad terminalsROW_PAD_E_1 and the first one of the second contact pad terminalsROW_PAD_F_1 may be formed. In this case, the first one of the firstcontact pad terminals ROW_PAD_E_1 is spaced apart from the first one ofthe second contact pad terminals ROW_PAD_F_1.

In this case, the first one of the first contact pad terminalsROW_PAD_E_1 may be electrically connected with the first terminal linePL_A_1 through a first contact hole CT_1 formed in the base film 310.When viewed on a plane, the first contact hole CT_1 may be disposedwhile overlapping the first one of the first contact pad terminalsROW_PAD_E_1. In this case, the first contact hole CT_1 may be filledwith the same metal as that of the first terminal line P_L_A_1, or maybe filled with the metal of the first one of the first contact padterminals ROW_PAD_E_1.

The first one of the second contact pad terminals ROW_PAD_F_1 may beformed on the same metal layer as that of the second terminal lineP_L_B_1. In the exemplary embodiment, the first one of the secondcontact pad terminals ROW_PAD_F_1 may correspond to an exposed region ofa part of the second terminal line P_L_B_1.

Referring to FIG. 20, the fourth terminal region TL_4 is a regioncorresponding to the second terminal region TL_2 of the substrate SUB,and the plurality of second contact terminals (not illustrated) may bedisposed on the fourth terminal region TL_4.

The plurality of second contact terminals (not illustrated) may bedisposed in the same pattern as that of the second pad terminalsPAD_TL_B disposed in the second terminal region TL_2. In this case, theplurality of second contact terminals (not illustrated) may include asimilar structure as that of the plurality of first contact terminalsPAD_TL_C.

In FIG. 20, all of the first contact terminals and the second contactterminals disposed in the third terminal region TL_3 and the fourthterminal region TL_4 may be disposed while being inclined at the sameangle with respect to the first direction. For example, the firstcontact terminals and the second contact terminals may be disposed whilebeing inclined in the direction of approximately one o'clock.

However, in the modified example of the printed circuit board of FIG.23, the first contact terminals and the second contact terminals may bedisposed in the pattern corresponding to the first pad terminalsPAD_TL_A and the second pad terminals PAD_TL_B of the first terminalregion TL_1 and the second terminal region TL_2 described above withreference to FIG. 19. That is, the first contact terminal PAD_TL_Cpositioned at a left side of the fourth terminal region TL_4 may bedisposed while being inclined in the direction of approximately oneo'clock based on the second direction, and the first contact terminalPAD_TL_C positioned at a right side of the fourth terminal region TL_4may be disposed while being inclined in the direction of approximatelyeleven o'clock based on the second direction.

The plurality of second contact terminals disposed in the fourthterminal region TL_4 may be symmetrically disposed based on a center ofthe fourth terminal region TL_4. For example, the plurality of leftsecond contact terminals based on the center of the fourth terminalregion TL_4 may be disposed while being inclined in the direction ofapproximately one o'clock based on the second direction, and theplurality of right second contact terminals based on the center of thefourth terminal region TL_4 may be disposed while being inclined in thedirection of approximately eleven o'clock based on the second direction.

Hereinafter, a coupled state of the first terminal region TL_1 and thethird terminal region TL_3 will be described in detail with reference toFIGS. 24 and 25.

FIG. 24 is a diagram schematically illustrating a state where the firstterminal region formed in the substrate is coupled to the third terminalregion formed in the printed circuit board, and FIG. 25 is across-sectional view taken along line XXV-XXV′ of FIG. 24.

The first contact terminals PAD_TL_C (see FIG. 21) may be disposed whileoverlapping the first pad terminals PAD_TL_A (see FIG. 5) oncross-sections of the first pad terminals PAD_TL_A (see FIG. 5). Moreparticularly, the first contact pad terminals ROW_PAD_E may overlap oncross-sections of the first connection pad terminals ROW_PAD_A, and thesecond contact pad terminals ROW_PAD_F may overlap on the secondconnection pad terminals ROW_PAD_B.

Further, a conductive attachment film 500 may be disposed between thefirst terminal region TL_1 and the third terminal region TL_3. Theconductive attachment film 500 may electrically connect the firstconnection pad terminals ROW_PAD_A and the first contact pad terminalsROW_PAD_E. Further, the conductive attachment film 500 may electricallyconnect the second connection pad terminals ROW_PAD_B and the secondcontact pad terminals ROW_PAD_F. The first connection pad terminalsROW_PAD_A may be electrically connected with the first contact padterminals ROW_PAD_E through a plurality of conductive balls CNB includedin the conductive attachment film 500. Further, the second connectionpad terminals ROW_PAD_B may be electrically connected with the secondcontact pad terminals ROW_PAD_F.

In the exemplary display devices, each of the first pad terminalsPAD_TL_A (see FIG. 5) includes the plurality of first connection padterminals ROW_PAD_A, the plurality of second connection pad terminalsROW_PAD_B, and the first terminal connection lines TL_CN_A, and thefirst terminal connection lines TL_CN_A electrically connecting thefirst connection pad terminal ROW_PAD_A, and the second connection padterminal ROW_PAD_B may be disposed on a different layer from that of thefirst connection pad terminals ROW_PAD_A and the second connection padterminals ROW_PAD_B.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of thepresented claims and various obvious modifications and equivalentarrangements.

What is claimed is:
 1. A display device, comprising: a substrateincluding a display area to display an image and a pad area positionedaround the display area; a first pad unit disposed on the pad area, andincluding a first terminal region having a plurality of first padterminals arranged in a first direction; and a printed circuit boardincluding a base film and a second pad unit positioned at one side ofthe base film, the second pad unit being coupled with the first pad unitby electrically connecting with the plurality of first pad terminals;wherein each of the plurality of first pad terminals includes: at leastthree first connection pad terminals arranged in a first row disposed ata first angle larger than 0° and smaller than 90° relative to the firstdirection, the plurality of first connection pad terminals being inelectrically connecting with the second pad unit of the printed circuitboard through a plurality of conductive balls; a plurality of secondconnection pad terminals spaced apart from the plurality of firstconnection pad terminals, and arranged in a second row disposed at asecond angle larger than 0° and smaller than 90° relative to the firstdirection, the plurality of second connection pad terminals being inelectrically connecting with the second pad unit of the printed circuitboard through another plurality of conductive balls; and a plurality offirst dummy pad terminals disposed between pairs of adjacent firstconnection pad terminals of the first connection pad terminals.
 2. Thedisplay device of claim 1, wherein: a first one of the first dummy padterminals is disposed between a first one of the first connection padterminals and a second one of the first connection pad terminals, and asecond one of the first dummy pad terminals is disposed between thesecond one of the first connection pad terminals and a third one of thefirst connection pad terminals.
 3. The display device of claim 2,wherein: the first connection pad terminals and the first dummy padterminals are arranged to be parallel to one another, and the firstconnection pad terminals and the first dummy pad terminals are seriallyarranged along the first row.
 4. The display device of claim 2, wherein:the first dummy pad terminals are floated without receiving a signal. 5.The display device of claim 1, further comprising: a plurality of seconddummy pad terminals disposed between pairs of adjacent second connectionpad terminals of the second connection pad terminals.
 6. The displaydevice of claim 5, wherein: a first one of the second dummy padterminals is disposed between a first one of the second connection padterminals and a second one of the second connection pad terminals, and asecond one of the second dummy pad terminals is disposed between thesecond one of the second connection pad terminals and a third one of thesecond connection pad terminals.
 7. The display device of claim 6,wherein: the second connection pad terminals and the second dummy padterminals are arranged to be parallel to one another, and the secondconnection pad terminals and the second dummy pad terminals are seriallyarranged along the second row.
 8. The display device of claim 6,wherein: the second dummy pad terminals are floated without receiving asignal.
 9. The display device of claim 1, further comprising: aplurality of first terminal connection lines configured to connect oneof the plurality of first connection pad terminals and one of theplurality of second connection pad terminals, and having at least onebent shape, wherein the first terminal connection line is disposed in adifferent layer from that of the first connection pad terminal and thesecond connection pad terminal.
 10. The display device of claim 9,wherein: a plurality of data lines and a plurality of gate linescrossing the plurality of data lines are disposed in the display area ofthe substrate.
 11. The display device of claim 10, wherein: at least oneof the plurality of first connection pad terminals and the plurality ofsecond connection pad terminals are disposed in a same layer as that ofthe plurality of data lines, and the plurality of first terminalconnection lines are disposed in a same layer as that of the pluralityof gate lines.
 12. The display device of claim 11, wherein: theplurality of gate lines include a plurality of first gate members and aplurality of second gate members disposed on the plurality of first gatemembers, and the plurality of first terminal connection lines aredisposed in a same layer as that of any one of the plurality of firstgate members and the plurality of second gate members.
 13. The displaydevice of claim 10, further comprising: a plurality of first connectionlines disposed in the pad area to connect the display area and theplurality of first connection pad terminals.
 14. The display device ofclaim 13, wherein: the plurality of first connection lines are disposedin a same layer as that of the plurality of data lines.
 15. The displaydevice of claim 13, wherein: the plurality of first connection lines aredisposed in a same layer as that of the plurality of gate lines.
 16. Thedisplay device of claim 15, wherein: the plurality of gate lines includea plurality of first gate members and a plurality of second gate membersdisposed on the plurality of first gate members, and the plurality offirst connection lines are disposed in a same layer as that of any oneof the plurality of first gate members and the plurality of second gatemembers.
 17. The display device of claim 10, further comprising: aplurality of first test lines connected to the plurality of secondconnection pad terminals, respectively, and extending to an end portionof one side of the substrate.
 18. The display device of claim 17,wherein: the plurality of first test lines are disposed in a same layeras that of the plurality of data lines.
 19. The display device of claim17, wherein: the plurality of first test lines are disposed in a samelayer as that of the plurality of gate lines.
 20. The display device ofclaim 19, wherein: the plurality of gate lines include a plurality offirst gate members and a plurality of second gate members disposed onthe plurality of first gate members, and the plurality of first testlines are disposed in a same layer as that of any one of the pluralityof first gate members and the plurality of second gate members.
 21. Thedisplay device of claim 1, wherein: the first angle is substantiallysame as the second angle.
 22. The display device of claim 1, wherein:the first pad unit further includes a second terminal region having aplurality of second pad terminals spaced apart from the first terminalregion.
 23. The display device of claim 22, wherein: each of theplurality of second pad terminals includes: a plurality of thirdconnection pad terminals arranged in a third row disposed at a thirdangle relative to the first direction; and a plurality of fourthconnection pad terminals spaced apart from the plurality of thirdconnection pad terminals, and arranged in a fourth row disposed at afourth angle relative to the first direction.
 24. The display device ofclaim 23, wherein: the third angle is substantially same as the fourthangle.
 25. The display device of claim 24 wherein: each of the thirdangle and the fourth angle is larger than 0° and smaller than 90°. 26.The display device of claim 23, wherein: the third angle issubstantially same as the first angle.
 27. The display device of claim23, further comprising: a plurality of second test lines connected tothe plurality of fourth connection pad terminals, respectively, andextending to an end portion of one side of the substrate.
 28. Thedisplay device of claim 1, wherein: each of the plurality of firstconnection pad terminals and the plurality of second connection padterminals has a plate-like, quadrangular shape.
 29. The display deviceof claim 28, wherein: the quadrangular shape is defined at least in partby a first side parallel to the first direction, and a second sideadjacent to the first side and parallel to a second direction crossingthe first direction, and the second side is longer than the first side.30. The display device of claim 1, wherein the second pad unit has ashape substantially corresponding to that of the first pad unit and,includes a plurality of first contact terminals coupled with theplurality of first pad terminals, and each of the plurality of firstcontact terminals includes: a plurality of first contact pad terminalsarranged in a fifth row disposed at the first angle relative to thefirst direction; and a plurality of second contact pad terminals spacedapart from the plurality of first contact pad terminals, and arranged ina sixth row disposed at the second angle relative to the firstdirection.
 31. The display device of claim 30, wherein: the printedcircuit board further includes a plurality of first terminal linesdisposed on the base film, and the plurality of first terminal lines areelectrically connected with the plurality of first contact pad terminalsdisposed under the base film by a plurality of first contact holespassing through the base film.
 32. The display device of claim 31,wherein: the plurality of first contact holes overlap the plurality offirst contact pad terminals, respectively.